Features:

• MiJing CH5-C Intelligent Mainboard Layered Welding for Apple iPhone 11 Pro/ 11 Pro Max.


• Solves the problem of repairing/maintaining of the Double – Layered Motherboard structure.


• Takes only 3 minutes to complete the Welding process.


• Fast rise in the temperature and equal heat distribution.


• Does not damage the motherboard.


• Compatible with only Apple iPhone 11 Pro/ 11 Pro Max.